Camera module, holder for use in a camera module, camera system and method of manufacturing a camera module

ABSTRACT

The invention relates to a camera module  100 . The camera module  100  comprises a holder  102 , which provides a light-conducting channel  122 . Within the light-conducting channel  122  a lens  120  having an optical axis  106  is present. A solid-state image sensor  113  is present near an end  128  of the light-conducting channel  122 . The image sensor  113  is provided with an image section  114 , which is oriented perpendicularly to the optical axis  106 . Near the end  128  of the light-conducting channel, forming part of the holder  102 , aligning means  131  are present for aligning the image section  114  with the optical axis  106 . In one embodiment of the camera module  100 , the inner wall  130  of the holder  102  is substantially rectangular, seen in cross-sectional view in a direction perpendicular to the optical axis  106 . Bulges  131  present near the corners of the rectangle form the aligning means. The bulges  131  are provided with L-shaped recesses  129  in which the lateral surfaces  127  of the solid-state image sensor  113  are placed substantially without play. This method of aligning the image section  114  with the optical axis  106  simplifies the manufacture of the camera module  100.

The invention relates to a camera module comprising a holder providedwith a light-conducting channel, within which channel a lens having anoptical axis is present, a solid-state image sensor being present nearan end of said light-conducting channel, which image sensor comprises animage section oriented perpendicularly to the optical axis.

The invention also relates to a holder provided with a light-conductingchannel, which holder is intended for use in a camera module, which isarranged for accommodating a lens having an optical axis and which isfurthermore arranged for placing a solid-state image sensor comprisingan image section near an end of the light-conducting channel.

The invention also relates to a camera system comprising a camera modulewith a holder.

The invention furthermore relates to a method of manufacturing a cameramodule comprising a holder.

Such a camera module is known from European patent application EP-A 1081 944. The known camera module is suitable for use in a camera system,such as a camera system incorporated in a telephone, in a portablecomputer or in a digital photo or video camera. With the known cameramodule, an image pickup module is placed into abutment with the secondend of the holder. The image pickup module of the known camera modulecomprises a substrate. Present on the side of the substrate facing awayfrom the holder, on which an electrically conductive wiring pattern hasbeen formed, is a solid-state image sensor, for example a CCD (ChargeCoupled Device) image sensor or a CMOS (Complementary Metal OxideSemiconductor) image sensor. The solid-state image sensor iselectrically connected to further electronics in a camera system ofwhich the camera module forms part by means of electrically conductiveconnections, for example in the form of bumps of a suitably selectedmaterial, such as gold or another electrically conductive material. Oneside of the solid-state image sensor facing towards the substratecomprises a light-sensitive area arranged for converting incident lightinto electrical signals.

In one embodiment of the known camera module, the substrate consists ofa non-transparent material, for example a metal plate covered with aflexible foil on which said wiring pattern is present, in which plate anaperture is present for transmitting light to the light-sensitive areaof the solid-state image sensor. In another embodiment, the substrateconsists of a light-transmitting material, such as glass, on which aconductive wiring pattern is present on the side facing towards thesolid-state image sensor.

One drawback of the known camera module is the fact that it requires acomplicated manufacturing method, which renders the camera modulerelatively costly.

It is an object of the invention to provide a camera module designed toenable simple manufacture. This object is achieved with a camera moduleaccording to the introductory paragraph, which is characterized in thataligning means forming part of the holder are present near the end ofthe light-conducting channel, which aligning means align the imagesection with respect to the optical axis.

In the camera module according to the invention, the position of thesolid-state image sensor in the holder is fixed by the aligning means.Thus the position of the image section with respect to the optical axisis fixed as well. During manufacture it suffices, therefore, to placethe solid-state image sensor in the holder, using the aligning means, inorder to align the image section with respect to the optical axis. Thisresults in a simplification of the manufacture of the camera module.

Furthermore it can be noted that the solid-state image sensor of thecamera module according to the invention is not accommodated in an imagepickup module, as is the case with the known camera module. Instead, thesolid-state image sensor can be placed directly in the holder. This initself already results in a simplification of the manufacture of thecamera module. An additional result is that a reduction of thedimensions of the camera module is obtained, in particular in adirection parallel to the optical axis. This is an advantage, too, sincethe amount of available space is very limited in many applications inwhich the camera module is used, and in all probability it will bereduced even further in future applications.

One embodiment of the camera module according to the invention ischaracterized in that the image section extends in a plane parallel to amain surface of the solid-state image sensor, in which the solid-stateimage sensor comprises lateral surfaces oriented at least substantiallyperpendicularly to the main surface, and in which the light-conductingchannel comprises an inner wall which is at least substantiallypolygonal near the end, seen in sectional view in a directionperpendicular to the optical axis, in which the aligning means comprisebulges present near the corners of the polygon, which bulges adjoin theinner wall and which abut against the lateral surfaces of thesolid-state image sensor, as a result of which the solid-state imagesensor is contained within the holder substantially without play in adirection perpendicular to the optical axis.

Since the bulges ensure that substantially no play remains between theinner wall of the holder and the lateral surfaces of the solid-stateimage sensor, the position of the solid-state image sensor and thus theposition of the image section is fixed in a plane perpendicular to theoptical axis of the lens. Thus it suffices to place the solid-stateimage sensor between the bulges, with the main surface extendingperpendicularly to the optical axis and facing towards the lens, inorder to align the image section with respect to the optical axis. Thisleads to a further simplification of the manufacture of the cameramodule as regards the alignment of the image section with respect to theoptical axis.

Another embodiment of the camera module according to the invention ischaracterized in that the bulges are provided with an L-shaped recess,seen in cross-sectional view in a direction perpendicular to the opticalaxis, with one side of the bulge adjoining the inner wall at all times,whilst another side abuts substantially without play against twomutually adjacent lateral surfaces of the solid-state image sensor.

When the bulges are configured in this way, it will be easier to placethe solid-state image sensor between bulges with the main surfaceextending perpendicularly to the optical axis and facing towards thelens. This leads to a further simplification of the manufacture of thecamera module as regards the alignment of the image section with respectto the optical axis.

Another embodiment of the camera module according to the invention ischaracterized in that the substrate abuts against the supportingsurface, which achieves that the image section is fixed in anorientation parallel to the optical axis.

After the solid-state image sensor has been bonded to the substrate, themain surface of the solid-state image sensor extends parallel to thatside of the substrate on which the solid-state image sensor is present,since the main surface and the second main surface extend parallel toeach other. As a result, the image section of the solid-state imagesensor, too, extends parallel to that side of the substrate on which thesolid-state image sensor is present. The supporting surface of theholder is oriented perpendicularly to the optical axis. This achievesthat the image section is oriented perpendicularly to the optical axisafter the holder has been placed on the substrate. This orientationleads to an improved quality of the images being projected onto theimage section in use by the lens. This orientation is achieved in asimple manner as a result of the construction of the holder as describedand the way in which it is attached to the substrate. This leads to afurther simplification of the manufacture of the camera module.

A holder according to the invention for use in a camera module, whichholder is provided with a light-conducting channel, which is arrangedfor accommodating a lens having an optical axis and which is furthermorearranged for placing a solid-state image sensor comprising an imagesection near an end of the light-conducting channel, is characterized inthat aligning means forming part of the holder are present near said endof the light-conducting channel for aligning the image section withrespect to the optical axis.

In the holder according to the invention, the position at which thesolid-state image sensor comprising the image section is to be placed isfixed by the aligning means. Thus, the position of the image sectionwith respect to the optical axis is fixed as well. Upon manufacture ofthe camera module it thus suffices to place the solid-state image sensorin the holder, using the aligning means, in order to align the imagesection with respect to the optical axis. Consequently, the manufactureof the camera module is simplified by using the holder according to theinvention when manufacturing the camera module.

A camera system according to the invention comprises a camera modulecomprising a holder provided with a light-conducting channel in which alens having an optical axis is present, in which a solid-state imagesensor provided with an image section oriented perpendicularly to theoptical axis is present near an end of the light-conducting channel, andin which aligning means forming part of the holder are present near saidend of the light-conducting channel for aligning the image section withrespect to the optical axis.

The camera system according to the invention employs a camera module inwhich the position of the solid-state image sensor in the holder isfixed by the aligning means. Thus, the position of the image sectionwith respect to the optical axis is fixed as well. During manufacture itsuffices, therefore, to place the solid-state image sensor in theholder, using the aligning means, in order to align the image sectionwith respect to the optical axis. This results in a simplification ofthe manufacture of the camera system.

A method of manufacturing a camera module comprising a holder ischaracterized in that the holder is provided with aligning means, inwhich the solid-state image sensor comes into contact with the aligningmeans upon placement of the solid-state image sensor in said holder, asa result of which an image section present on the solid-state imagesensor is aligned with respect to an optical axis.

During manufacture, a lens having an optical axis is placed in theholder. For a correct operation of the camera module it is importantthat the solid-state image sensor is aligned with respect to the opticalaxis in a plane perpendicular to the optical axis. In order to achievethis, the camera module is provided with aligning means uponmanufacture. Automatic alignment of the image section with respect tothe optical axis is achieved by placing the solid-state image sensorinto contact with the aligning means upon placement of the solid-stateimage sensor in the holder. This results in a simplification of themanufacture of the camera system.

These and other aspects of the invention will now be discussed in moredetail with reference to the drawings, in which:

FIGS. 1A-D schematically show an embodiment of the camera moduleaccording to the invention;

FIGS. 2A-C schematically show a manufacturing step of the camera moduleaccording to the invention;

FIGS. 3A-C schematically show a further manufacturing step of the cameramodule according to the invention;

FIGS. 4A-C schematically show a further manufacturing step of the cameramodule according to the invention;

FIGS. 5A-B schematically show in perspective view of the holder of thecamera module;

FIGS. 6A-C schematically show a further manufacturing step of the cameramodule according to the invention;

FIGS. 7A-C schematically show a further manufacturing step of the cameramodule according to the invention;

FIGS. 8A-C schematically show a further manufacturing step of the cameramodule according to the invention; and

FIG. 9 schematically shows in perspective view a second embodiment of aholder for a camera module according to the invention.

In the figures, like parts are indicated by the same numerals.

FIGS. 1A-D schematically show an embodiment of the camera moduleaccording to the invention. FIG. 1A is a side elevation of a cameramodule 100 according to the invention. The camera module comprises abarrel 101 which is mounted in a holder 102, a substrate 104 of aflexible material (a flex foil), on which the holder 102 is present, aseal 103 consisting of glob top material for sealing the joint betweenthe holder 102 and the substrate 104, and a stiffener 105 for stiffeningthe substrate. The optical axis of the camera module is illustrated inthe broken line 106. A usual height of the camera module, measured fromthe barrel 101 to the stiffener 105, is about 5.0-5.5 mm, for example. Ausual diameter of the barrel is about 5.5-6.0 mm, for example.

FIG. 1B shows the camera module 100 in top plan view. The figure showsthe substrate 104 with the glob top material 103 present thereon, aswell as the holder 102 and the barrel 101, respectively. The opticalaxis 106 is represented by the point of intersection of the lines 110and 111. In addition to that, the holder 102 has a central axis. Afterassembly of the camera module, said central axis extends parallel to theoptical axis 106. In FIG. 1B said central axis is represented by thepoint of intersection of the lines 111 and 118. A usual width of theholder is about 6.0-6.5 mm. for example. A usual length of the holder isabout 6.5-7.0 mm, for example. FIG. 1B also shows a lens aperture 112 inthe barrel 101 for transmitting light. Furthermore, FIG. 1B shows asolid-state image sensor 113 with an image section 114 present thereon.The solid-state image sensor 113 is provided with bond pads 115, whichelectrically connect the integrated electronic circuits on thesolid-state image sensor 113 to pads 117 on the substrate via bondingwires 116. The pads 117 can be connected to other electronic circuitsand to a power supply, for example a battery or the output of a mainsadapter, in a camera system by means of a pattern of conductive tracks.In this way the solid-state image sensor 113 can be supplied with therequired electric voltages, and electrical signals, which are generatedby the incident light in the image section 114, for example, can betransmitted to the other electronic circuits in the camera system.

FIG. 1C is a longitudinal sectional view of the camera module 100 alongthe plane AA′ in FIG. 1B, which is oriented parallel to the optical axis106. The figure shows the barrel 101 containing a lens 120 and aninfrared filter 121, with the lens aperture 112 being present at theupper side. The barrel 101 is mounted in the holder 102. Inside theholder 102 is a light-conducting channel 122 having an end 128. Abonding area 123 is present at the end 128 of the light-conductingchannel 122. Disposed between the bonding area 123 and the substrate 104is an adhesive material 124, for example a suitably selected glue, bymeans of which the holder 102 is attached to the substrate 104. Presenton the outer side of the holder 102, near the point of attachment of theholder 102 to the substrate, is the glob top material 103, which fullycovers the adhesive material 124. Thus the connection between the holder102 and the substrate 104 is strengthened and protected. The solid-stateimage sensor 113 comprises a main surface 125, which faces towards thelens 120, and a second main surface 126, which is attached to thesubstrate 104 in a usual manner. The main surface 125 and the secondmain surface 126 are oriented perpendicularly to the optical axis 106.FIG. 1C furthermore shows the lateral surfaces 127 of the solid-stateimage sensor 113. Said surfaces abut the main surface 125 and the secondmain surface 126, being oriented perpendicularly thereto. Finally, FIG.1C also shows the bonding wires 116, which electrically connect the bondpads 115 that are shown in FIG. 1B to the pads 117.

FIG. 1D is a cross-sectional view of the camera module 100 along theplane BB′ in FIG. 1A, which plane is oriented perpendicularly to theoptical axis 106. The figure shows the holder 102 and an inner wall 130in cross-sectional view. The inner wall 130 is rectangular along theplane BB′. Disposed within this said rectangle is the solid-state imagesensor 113, whose main surface 125 and the image section 114 presentwithin the confines thereof is shown in top plan view. The main surface125 is likewise rectangular, and it is enclosed by the inner wall 130.Bulges 131 are present near the comers of the rectangle formed by thecross-section of the inner wall.

On the one hand, the bulges 131 comprise an L-shaped recess 129, and onthe other hand they abut the inner wall 102 in the comers. As a result,the bulges 131 are likewise L-shaped, seen in the cross-sectional viewof FIG. 1D. The recesses 129 in the bulges 131 abut the lateral surfaces127 of the solid-state image sensor 113 substantially without play. Thisachieves that the image section 114 is aligned with respect to theoptical axis 106. In FIG. 1D, the bulges 131 are separated from theholder 102 by a broken line 132 for the sake of clarity. In actual factthe bulges 131 will usually be integral with the holder 102, since thissimplifies the manufacture of the whole.

Within the holder 102, space has been left for the pads 117 and thebonding wires 116 between the inner wall 130 and the lateral surfaces127 of the solid-state image sensor, so that said pads and said bondingwires are entirely confined within the holder 102. The practicaladvantage of this configuration is that the bonding wires 116, which aremechanically fairly vulnerable, are screened in this way. In addition tothe elements that have already been mentioned, FIG. 1D also shows thesubstrate 104 and the glob top material 103 that strengthens andprotects the connection between the holder 102 and the substrate 104.

A camera system in which the camera module 100 is used has thisadvantage that it can be small, since the dimensions of the cameramodule 100 are small in comparison with those of known camera modules.Another advantage of a camera system in which the camera module 100 isused is that it is cheaper to produce, since the camera module 100 issimpler and can thus be produced at lower cost than known cameramodules.

FIGS. 2A-C schematically show a manufacturing step of the camera moduleaccording to the invention. FIG. 2A is a side elevation, in which thesolid-state image sensor 113 is present on the substrate 104, with thestiffener 105 being present on the other side of the substrate 104. FIG.2B is a top plan view of the solid-state image sensor 113 that ispresent on the substrate 104. Disposed within the confines of the mainsurface 125 of the solid-state image sensor 113 is the image section114, as are the bond pads 115 being arranged in rows near the lateralsurfaces 127 and extending parallel thereto. Present on the side of thesubstrate 104 to which the solid-state image sensor 113 is attached arealso the pads 117. Said plans extend parallel to the lateral surfaces127. FIG. 2C schematically shows in perspective view the placing of thesolid-state image sensor 113 on the substrate 104.

It is common practice to test the functionality of the solid-state imagesensor 113 before starting the assembly of the camera module 100.Normally, this takes place while the solid-state image sensor 113 isstill present on a wafer. After such a functional test has been carriedout, the wafer is diced. The solid-state image sensors 113 that havepassed the functional test are subsequently used in the manufacture ofthe camera module 100. This prevents non-functioning solid-state imagesensors 113 being used upon manufacture of camera modules.

An adhesive is applied to the flex foil substrate 104 before thesolid-state image sensor 113 is bonded to the substrate 104. Saidadhesive may be a usual glue or a PSA foil. Subsequently, thesolid-state image sensor 113 is placed on the substrate by means of apick and place machine, and the second main surface 126 is placed intocontact with the substrate. Following this, the adhesive is cured.

FIGS. 3A-C schematically show a manufacturing step of the camera moduleaccording to the invention. FIG. 3A is a side elevation which shows, inaddition to the elements that are shown in FIG. 2A, the bonding wires116 that connect the bond pads 115 (not shown) to the pads 117 (likewisenot shown) on the substrate 104. FIG. 3B is a top plan view which shows,in addition to the elements that are shown in FIG. 2B, the bonding wires116 that connect the bond pads 115 to the pads 116 on the substrate.FIG. 3C is a schematic, perspective view of the solid-state image sensor113 provided with the image section 114, which is present on thesubstrate 104, in which the bond pads 115 of the solid-state imagesensor 113 are connected to the pads 117 on the substrate by means ofthe bonding wires 116.

After curing of the adhesive by means of which the solid-state imagesensor 113 is attached to the substrate 104, the bonding wires 116 thatelectrically connect the bond pads 115 to the pads 117 are provided. Itmay be advantageous in that connection if the stiffener 105 is present.As a result of the presence of said stiffener, the assembly consistingof the solid-state image sensor 113 and the substrate is easier tohandle during the wire bonding process, i.e. the provision of thebonding wires. Said wire bonding may take place in a known manner.Electrical connections between integrated circuits on a solid-stateimage sensor and electrical connections on a substrate may also beeffected in a different manner, for example by means of stud bumps. Onedrawback of the use of stud bumps, however, is the fact that theyrequire larger pads on the solid-state image sensor 113.

FIGS. 4A-C schematically show a further manufacturing step of the cameramodule according to the invention. FIG. 4A is a side elevation, whichshows the same elements as in FIG. 3A. FIG. 4B is a top plan view whichshows, in addition to the elements that are present in FIG. 3B, theadhesive material 124 after it has been applied to the substrate 104.The adhesive material forms an at least substantially rectangularpattern on the substrate 104 along the circumference of the solid-stateimage sensor 113 that is present on the substrate 104. The form and thedimensions of the pattern in which the adhesive material has beenapplied are at least substantially identical to the form and thedimensions of the end of the light-conducting channel of the holder 102.FIG. 4C is a perspective view which shows, in addition to the elementsthat are shown in FIG. 3C, the adhesive material 124 after it has beenapplied to the substrate 104.

The adhesive material 124, which may be a glue which is commonly usedfor this purpose, has been applied in a pattern in which space has beenleft between the solid-state image sensor 113 and the adhesive material124. It is in particular important that space be left on the substrate104 in the direct vicinity of the corners of the solid-state imagesensor 113. If adhesive material 124 would actually be present at theselocations, this might result in a tilt of the image section 114 withrespect to the optical axis 106. In other words, the image section 114would not be positioned in a plane oriented perpendicularly to theoptical axis 106. This leads to a decreased quality of the image that isformed on the image section 114 by the lens 120 in use.

FIGS. 5A-B schematically show the holder 102 of the camera module 100 inperspective view. FIG. 5A is a schematic, perspective view of the holder102, seen from the side that is placed into abutment with the substrate104. The figure shows the bulges 131 that are present in the inner wall130 of the holder 102, near the comers of the light-conducting channel122. The bulges 131 are provided with an L-shaped recess 502, seen insectional view in a direction perpendicular to the central axis, so thatthe bulges 131 are likewise L-shaped, seen in the same sectional view.Once the assembly of the camera module is complete, the central axis ofthe holder 102 extends parallel to the optical axis 106, as is shown inFIG. 1B. FIG. 5A also shows the bonding area 123 to be present at theend 128 of the light-conducting channel 122, which surface is orientedperpendicularly to the central axis of the holder 102.

FIG. 5B is an enlarged view of one of the bulges 131 and an adjoiningpart of the inner wall 130 of the holder 102 and the bonding area 123.FIG. 5B furthermore shows more clearly that the bulges 131 partiallyextend outside the light-conducting channel 122. Each of the bulges 131has a second end 501, which extends in a plane perpendicular to thecentral axis of the holder 102. Said second ends jointly form asupporting surface, which is oriented perpendicularly to the centralaxis of the holder 102.

After the adhesive material 124 has been applied to the substrate 104,the holder 102 is placed over the solid-state image sensor 113 on thesubstrate 104. On the other hand, it may be advantageous to arrange theassembly comprising the solid-state image sensor 113 and the substrate104 inside the holder 102. This may depend on the productioncircumstances. In both cases the second ends 501 of the bulges 131 makecontact with the substrate 104, as a result of which the solid-stateimage sensor is oriented perpendicularly to the central axis of theholder 102 and consequently also perpendicularly to the optical axis 106of the lens 120 that is yet to be placed. The L-shaped recesses 502 ofthe bulges 131 come into contact with the lateral surfaces 127 of thesolid-state image sensor 113, as a result of which the position of theimage section 114 of the solid-state image sensor with respect to thecentral axis of the holder 102 is fixed. By this, the image section 114is also aligned with respect to the optical axis 102 of the lens 120, ifsaid lens is present. The bonding area 123 is placed into contact withthe adhesive material 124, by which the position of the holder 102 withrespect to the substrate 104 is fixed.

The adhesive material 124 also functions to seal the interior part ofthe holder 102 in which the solid-state image sensor 113 is now present.Another advantage of the holder 102 and of the way of attachment to thesubstrate thereof is that the adhesive material 124 and the glob topmaterial 103 (yet to be provided) remain separated from the imagesection 113 by a relatively large distance, so that the latter will notbecome soiled with adhesive material or glob top material.

FIGS. 6A-C schematically show a further manufacturing step of the cameramodule according to the invention. FIG. 6A is a side elevation of theholder 102, which is attached to the substrate 104 by means of theadhesive material 124, with the stiffener 105 being present on the otherside of the substrate. FIG. 6B is a top plan view of the holder 102attached to the substrate 104 by means of the adhesive material 124. Theadhesive material 124 partially extends outside the holder 102. Thissimplifies the application of the adhesive material to the substrate 104in a previous step, since a proper bond remains ensured, also if theapplication of the adhesive material takes place relativelyinaccurately. Furthermore, part of the solid-state image sensor 113 andthe image section 114 present thereon can be seen via thelight-conducting channel 122.

FIG. 6C shows in perspective view the holder 102, which is attached tothe substrate 104 via the adhesive material 124, with the stiffener 105being present on the other side of the substrate 104.

FIGS. 7A-C schematically show a further manufacturing step of the cameramodule according to the invention. FIG. 7A is a side elevation whichshows, in addition to the elements that are shown in FIG. 6A, the globtop material 103 which abuts both the outer side of the holder 102 andthe substrate 104, and which screens and strengthens the connectionbetween the two formed by the adhesive material 124. FIG. 7B is a topplan view which shows, in addition to the elements that are shown inFIG. 6A, the glob top material 103. FIG. 7C is a perspective view whichshows, in addition to the elements that are shown in FIGS. 6C, the globtop material 103.

The viscosity of the glob top material 103 being used must not be toolow upon application thereof, since otherwise the material will notremain in contact with the outer side of the holder 102 to a sufficientdegree. The provision of the glob top material may be omitted undercertain circumstances, if the adhesive material 124 itself provides asufficient seal and a sufficiently strong connection between the holder102 and the substrate 104. It is also possible not to apply the glob topmaterial 103 until the barrel 101 containing the lens 120 has beenplaced in the holder 102. Since the glob top material 103 must generallybe cured at a relatively high temperature, however, this means that thematerial of the lens 120 must be capable of withstanding said hightemperature.

FIGS. 8A-C schematically show a further manufacturing step of the cameramodule according to the invention. FIG. 8A is a side elevation whichshows, in addition to the elements that are shown in FIG. 7A, the barrel101 containing the lens 120, which is mounted in the holder 102. FIG. 8Bis a top plan view which shows, in addition to the elements that arepresent in FIG. 7B, the barrel 101 mounted in the holder 102, whichbarrel contains the lens 120, which is disposed behind the lens aperture112. FIG. 8C is a perspective view which shows, in addition to theelements that are shown in FIG. 7C, the barrel 101 mounted in the holder102, which barrel contains the lens 120, which is disposed behind thelens aperture 112.

The barrel 101 has an outer side which is cylindrical in shape, with theaxis of the cylinder coinciding with the optical axis 106 of the lens120. The part of the holder 102 in which the barrel 101 is mounted has acylindrical inner side whose central axis extends parallel to thecentral axis of the holders 102, which inner side corresponds to theouter side of the barrel. The outer side of the barrel 101 and the innerside of the holder 102 may be smooth, so that the barrel is slid intothe holder 102 upon assembly. The outer side of the barrel 101 and theinner side of the holder 102 may also be provided with two mating screwthreads, in which case the barrel 101 is screwed into the holder 102upon assembly. In both cases the lens 101 is focused with respect to theimage section 114 of the solid-state image sensor 113, after which thebarrel 101 is fixed in position with respect to the holder 102 in ausual manner, for example by means of suitably selected glue, or bymeans of laser welding or an ultrasonic welding technique.

FIG. 9 is a perspective view of a second embodiment of a holder for acamera module according to the invention. The holder 900 is providedwith a light-conducting channel 901 having a central axis which, aftermounting of a barrel containing a lens, for example the barrel 101containing the lens 120 that is shown in FIGS. 1A-D, extends parallel tothe optical axis of the lens. The end of the light-conducting channel901, which is indicated by the arrow 902, comprises a bonding area 903,via which the holder 900 can be attached to a substrate. Near the end902, the light-conducting channel 901 is substantially rectangular, seenin sectional view in a direction perpendicular to the central axis, withbulges provided with L-shaped recesses 905 being present in the comers.After assembly of a camera module, the L-shaped recesses abut thelateral surfaces of a solid-state image sensor, for example thesolid-state image sensor 113 that is shown in FIGS. 1A-D, substantiallywithout play.

The L-shaped recesses 905 do not continue over the entire bulge 904, butthey each terminate on an end surface 906 extending in a directionperpendicular to the central axis of the light-conducting channel 901.The end surfaces 906 jointly form an abutting surface perpendicular tothe central axis of the light-conducting 901. After assembly of thecamera module, said abutting surface abuts against the main surface ofthe solid-state image sensor, for example the main surface 125 of thesolid-state image sensor 113. In this way it is ensured that an imagesection of the solid-state image sensor, for example the image section114 of the solid-state image sensor 113, is oriented perpendicularlywith respect to the optical axis. This has a positive effect on thequality of the image being projected onto the image section by the lens.

The holder 900 furthermore has an outer wall 908, which is rectangular,seen in sectional view in a direction perpendicular to the central axis,and recesses 909 in the form of a segment of a cylinder extending in adirection parallel to the central axis are present in the comers. Oneadvantage of these recesses is the fact that they make it easier tohandle the holder upon manufacture of the camera module. Finally, theholder 900 may be provided with an infrared filter extending in adirection perpendicular to the central axis of the light-conductingchannel.

It will be understood that the invention is not limited to the examplesthat are given herein, but that a great many additional variants arepossible within the scope of the invention. Thus, the order in which thevarious elements of the camera module 100 are assembled may be adaptedas the production circumstances require. Furthermore it will beunderstood that whilst a barrel containing one lens is shown in theembodiments that are shown herein, it is possible to substitute saidlens for a system of lenses. It will also be understood that thesubstrate 104 does not necessarily have to be a flexible foil, but thatit is also possible to use a usual PCB printed circuit board) materialfor this purpose. One advantage of the use of a PCB substrate is thefact that it makes it easier to test the camera module, since it isrelatively easy to attach test pads thereto. This may be done on anunused portion on the side of the substrate to which the holder 102 isattached. It is also possible in many cases to attach the test pads tothe substrate on the other side thereof. Furthermore it will be apparentto those skilled in the art that it is possible to use a solid-stateimage sensor that is sensitive to electromagnetic radiation other thanvisible light instead of the solid-state image sensor that is sensitiveto light.

Summarizing the above, the invention relates to a camera module 100. Thecamera module 100 comprises a holder 102, which is provided with alight-conducting channel 122. Present in said light-conducting channel122 is a lens 120 having an optical axis 106. Disposed near an end 128of the light-conducting channel 122 is a solid-state image sensor 113,which is provided with an image section 114 that is orientedperpendicularly to the optical axis 106. Aligning means 131 forming partof the holder 102 are present near the end 128 of the light-conductingchannel 122. Said aligning means align the image sensor 114 with respectto the optical axis 106. In one embodiment of the camera module 100, theinner wall of the holder 102 is substantially rectangular near the end128, seen in sectional view in a direction perpendicular to the axis,and the aligning means are formed by bulges 131 that are disposed nearthe comers of the rectangle. The bulges 131 are provided with anL-shaped recess, which abuts the lateral surfaces 127 of the solid-stateimage sensor 113 substantially without play. This manner of aligning theimage section 114 with respect to the optical axis simplifies themanufacture of the camera module 100.

1. A camera module comprising a holder provided with a light-conductingchannel, within which channel a lens having an optical axis is present,a solid-state image sensor being present near an end of saidlight-conducting channel, which image sensor comprises an image sectionoriented perpendicularly to the optical axis, characterized in thataligning means forming part of the holder are present near the end ofthe light-conducting channel, which aligning means align the imagesection with respect to the optical axis.
 2. A camera module as claimedin claim 1, characterized in that the image section extends in a planeparallel to a main surface of the solid-state image sensor, in which thesolid-state image sensor comprises lateral surfaces oriented at leastsubstantially perpendicularly to the main surface, and in which thelight-conducting channel comprises an inner wall which is at leastsubstantially polygonal near the end, seen in sectional view in adirection perpendicular to the optical axis, in which the aligning meanscomprise bulges present near the corners of the polygon, which bulgesadjoin the inner wall and which abut against the lateral surfaces of thesolid-state image sensor, as a result of which the solid-state imagesensor is contained within the holder substantially without play in adirection perpendicular to the optical axis.
 3. A camera module asclaimed in claim 2, characterized in that said polygon is a rectangle.4. A camera module according to claim 2, characterized in that saidbulges are provided with an L-shaped recess, seen in cross-sectionalview in a direction perpendicular to the optical axis, with one side ofthe bulge adjoining the inner wall at all times, whilst another sideabuts substantially without play against two mutually adjacent lateralsurfaces of the solid-state image sensor.
 5. A camera module as claimedin claim 2, characterized in that the end of the light-conductingchannel forms a bonding area extending perpendicularly to the opticalaxis.
 6. A camera module as claimed in claim 2, characterized in thatsaid bulges partially extend outside the light-conducting channel, eachbulge having a second end, which ends jointly form a supporting surfacewhich is oriented perpendicularly to the optical axis.
 7. A cameramodule as claimed in claim 5, characterized in that the camera modulecomprises a substrate, in which the solid-state image sensor comprises asecond main surface bonded to the substrate, in which the substrate isbonded to the bonding area by means of an adhesive material.
 8. A cameramodule as claimed in claim 7, characterized in that the substrate abutsagainst the supporting surface, which achieves that the image section isfixed in an orientation parallel to the optical axis.
 9. A holder foruse in a camera module, which holder is provided with a light-conductingchannel, which is arranged for accommodating a lens having an opticalaxis and which is furthermore arranged for placing a solid-state imagesensor comprising an image section near an end of the light-conductingchannel, characterized in that aligning means forming part of the holderare present near said end of the light-conducting channel for aligningthe image section with respect to the optical axis.
 10. A holder asclaimed in claim 9, characterized in that the holder comprises an outerwall which is at least substantially polygonal, seen in sectional viewin a direction perpendicular to the optical axis, in which recesses arepresent in the outer wall near the corners, which recesses extend in adirection parallel to the optical axis.
 11. A camera system comprising acamera module with a holder provided with a light-conducting channel inwhich a lens having an optical axis is present, in which a solid-stateimage sensor provided with an image section oriented perpendicularly tothe optical axis is present near an end of the light-conducting channel,and in which aligning means forming part of the holder are present nearsaid end of the light-conducting channel for aligning the image sectionwith respect to the optical axis.
 12. A method of manufacturing a cameramodule comprising a holder, characterized in that the holder is providedwith aligning means, in which the solid-state image sensor comes intocontact with the aligning means upon placement of the solid-state imagesensor in said holder, as a result of which an image section present onthe solid-state image sensor is aligned with respect to an optical axis.